Reliability for the 21st Century: Challenges of New Packaging Technologies and Markets

When:
April 25, 2018 @ 11:30 am – 1:00 pm America/Los Angeles Timezone
2018-04-25T11:30:00-07:00
2018-04-25T13:00:00-07:00
Where:
City: Santa Clara
Contact:
anmalik@ieee.org

Electronics components are constantly evolving, with new types of devices rapidly entering new markets. New technologies are significantly more complex than the technologies of the past, characterized by smaller features and heterogeneous integration. New markets, on the other hand, bring about new types of environments, new customer expectations and new usage models. Existing industry standards often do not provide sufficient guidance for qualification of new technologies. This requires packaging design and reliability practitioners to look beyond the existing reliability standards so that they make sure their components are designed correctly for the new field.
This talk discusses challenges with many standards-based approaches for definition of qualification requirements and proposes a methodology for overcoming those challenges. The proposed methodology leverages advanced tools of contemporary engineering to comprehend use conditions and failure physics. The special focus is on the essential role of the physics-based damage metrics in translating from use condition to test conditions and in design for reliability. Examples from the area of electronic packaging design and qualification published in the literature will be used to discuss the proposed methodology relative to the standards-based qualifications.

Speaker(s): Dr Milena Vujosevic,

Location:
Santa Clara, California
95054