Edge Computing and Artificial Intelligence: What Electronics Packaging Engineers Need to Know

When:
October 10, 2018 @ 11:30 am – 1:30 pm America/Los Angeles Timezone
2018-10-10T11:30:00-07:00
2018-10-10T13:30:00-07:00
Where:
City: Milpitas
Contact:
anmalik@ieee.org

Summary: Advanced Networking Technology has been the key driver of internet traffic over the past two decades. It has spearheaded the prevalence of smartphones, big data, voice and video. The challenges and opportunities for advanced packaging in Networking Applications, IoT, Edge Computing and Artificial Intelligence will be outlined.
Networking is now driving the exponential growth of Internet of Things (IoT) — more devices and machines connected to each other and the internet. Key to delivering the IoT ecosystem is Edge Computing. As more devices are connected to each other, the latency and bandwidth of the connections between the devices becomes a critical bottleneck. Edge computing strives to balance the need for faster connectivity with the cost, resilience and scalability challenges of hyper-connected devices. In addition to enabling IoT, Networking is also driving the incorporation of Artificial Intelligence (AI) into IoT devices and in the network itself. AI is helping networks connect, repair and defend themselves, ensuring speed, scalability and security. In this talk, the key trends and challenges in Networking as they relate to IoT, Edge Computing and Artificial Intelligence will be presented, with a focus on packaging.

Speaker(s): Mudasir,

Location:
Bldg: Seminar 1
673 S Milpitas Blvd
Milpitas, California
95035