Advanced Packaging Trends & Electronic Materials in Era of Digital Transformation

When:
June 28, 2019 @ 11:30 am – 1:00 pm America/Los Angeles Timezone
2019-06-28T11:30:00-07:00
2019-06-28T13:00:00-07:00
Where:
City: Milpitas
Contact:
MAILTO:anmalik@ieee.org

Digital transformation is further expanding into new markets bringing new application opportunities and driving increased adoption of electronics and semiconductor devices. The explosion of new applications is driving the semiconductor industry to transition from a technology node to an application driven industry. While advancing the technology node continues, new architectures and integration technologies are being developed to address increasing market requirements and the need of integrating more functionalities within smaller and more compact systems. A wide range of packaging technologies have already been successfully developed and adopted in the industry enabling single and multi-die packaging. While these technologies will continue to grow and further evolve, heterogeneous integration is gaining a lot of interest in the industry due to several benefits it can bring. This will also drive the need for more performing electronic materials and processes.

The presentation will provide an overview of the major trends (5G, Artificial Intelligence, IoT, Autonomous Driving, etc.) driving the semiconductor and packaging industry. The talk will highlight the various packaging platforms and their evolution as well as the material and processing challenges and needs driven by these applications.

Speaker(s): Rozalia,

Location:
Bldg: SEMI International Headquarters
673 S Milpitas Blvd
Milpitas, California
95035